Are there any electropolishing solutions that would polish both W and Cu at a similar rate? Or any alternative methods? I'm trying to run EBSD on both phases but getting poor registration on Cu, I believe because it is eroded more quickly than W during mechanical polishing.
Any advice on polishing methods for composite materials with a very hard and very soft phase would be appreciated.
Polishing a composite material, like a W-Cu alloy, can be challenging due to the differences in hardness between tungsten (W) and copper (Cu).
Tungsten is indeed much harder than copper, which can lead to preferential erosion of the copper during mechanical polishing and uneven surfaces that interfere with electron backscatter diffraction (EBSD) analyses.
Here are some strategies to consider:
Remember, polishing is an iterative process that often requires multiple attempts and fine-tuning to achieve the desired results. Therefore, it might be necessary to experiment with a combination of these techniques until you achieve a sufficient surface quality for EBSD.
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