I am trying to analyze using several softwares, how much of the oxide area has been deposited by my technique. The layer formed is not homogeneous and I need a way of calculating how much material has been deposited. I am currently using WSxM software with the flooding option which estimates this same thing, but I am noticing it is very arbitrary as it all depends the height you want to choose as your threshold. For example some times the substrate can be considered 0nm so anything above 0.1nm can be considered material deposited, but other times, the substrate seems to be starting at 0.5nm so if you use the previous value of 0.1nm you wouldn't get anything flooded. Hence I need to use 0.6nm and this is quite arbitrary and depends completely of what I want.

If anyone can tell me a better method for calculating the percentage coverage, taking in mind the material is very poorly adhered to the surface (so any contact or intermitent contact between tip and sample will destroy both, hence techniques such as adhesion comparison cannot be used as a contact is needed).

And a second question: Is there any way to do adhesion mapping in tapping mode in no contact regime completely?

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