A prerequisite for such an application is that the quality of the
adhesive bond can be controlled. Various non-destructive testing (NDT) techniques are adequate for the characterization of defects like pores or debonding within adhesive bond.
Thank you for sharing. It´s not my field, but I´m following and reading with interest.
Dear Amir,
I suggest you this paper.
Article IR thermography for interface analysis of FRP laminates exte...
Dear Franz Berge,
Actually just to check quality of bonding.
Thank you for the involvement.
Dear Amir,
it depends very much from a number of parameters. One of the most important is the depth of the bonding. We had excellent results up to 6mm GFRP. You can have a look to these papers. If you could share more details (materials, layups, minimum expected defect etc) I could be more helpful.
Best regards
Conference Paper ULTRASONIC AND THERMOGRAPHIC ANALYSIS OF COMPOSITE ADHESIVE ...
Conference Paper Thermal analysis and mechanical characterization of GFRP joints
Article Non-destructive defect characterization of concrete structur...
Thermography can provide a very accurate quantitative metric of the bond interface condition using the Thermographic Signal Reconstruction (TSR) method. However, the determination of "quality" of anything other than extremely weak bonds will require some initial destructive testing to calibrate the thermography results.
Researchers have demonstrated that the algorithm of inspect of CFRP, can effectively detect and evaluate the impact damage of thermal images and the accuracy of quantitative assessment is correspondingly increased. Also dependes on the method of image processing and active infrared thermography technique selected.
Just to be clear - Quality of bonding means to control presence of defects in the gluing of the FRP strips laid along the internal side of the minaret. IR thermography is supposed to provide an estimation of the number and position of detached areas of CFRP strips.
Dear Umberto,
Thank you very much for the shared documents and help you offered.
Thanks for clarifying what you mean by "quality", Amir. In that context you can definitely use thermography, but as Umberto Galietti mentioned, the thickness of the top layer is a key parameter. You will only be able to image the unbonded areas where the diameter is greater than the thickness of the top layer. In other words, your minimum detectable flaw size becomes larger as the top layer becomes thicker.
