I need a rough copper surface for good adhesion as a conductive substrate. Copper foil thickness is about 20 microns.
You may run cyclic voltammetry for multiple cycles (100 cycles or more) in 0.5M H2SO4.
Hi Hossein Ahmadi ,
You can check this paper:
https://journals.aps.org/pre/pdf/10.1103/PhysRevE.59.5133
Most of the late transition metals including the noble ones gets roughened upon electrochemical cycling. It is all about the potential window and solutions you are using. I believe as along as you can leach ( corrode, dissolve whatever you call) they supersaturate and nucleate back on the surface. One thing important is you may not wanna have too much roughness ( or create porous structures) because this would possibly change the mechnical properties of your surface dramatically. The roughening procedure applied commonly for SERS might be nice guide for you.
We might roughen copper foil surface using electrochemical electrodeposition and reverse electrodeposition by means of cyclic voltammetric, potentiostatic, galvanostatic, pulse-rest and pulse-reverse plating modes in a simple acidic CuSO4 bath, even without any additives[1].
Also, nanocrystalline copper films are never ... flat[2].
1. Effects of deposition modes on the microstructure of copper ... https://www.sciencedirect.com/science/article/abs/pii/S0257897203000045
2. Nanocrystalline copper films are never flat http://science.sciencemag.org/content/357/6349/397.full
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