I’m studying the annealing effect on copper hybrid bonding using COMSOL and analyzing how thermal expansion evolves over time at specific temperatures (e.g., 200°C to 350°C). My simulations show thermal expansion saturate within a second at a particular temperature when analysing the time-dependent thermal expansion. How can I refine COMSOL parameters (e.g., material properties or boundary conditions) to better align with experimental data? Are there specific models or coupling effects (e.g., thermal-mechanical) that accurately capture such trends? Any guidance on improving the simulation for time and temperature effects in copper bonding would be helpful!

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