Several steps can be taken to improve gold adhesion during e-beam evaporation. Firstly, cleaning substrates thoroughly using solvents like acetone and isopropanol, then deionized water, and drying with nitrogen is crucial. Plasma cleaning can be considered for a more thorough cleaning. Secondly, depositing a very thin layer of titanium before a gold deposition can promote adhesion (a few nm), and depositing gold immediately afterwards can prevent titanium oxide formation. Additionally, controlling deposition rates, and substrate heating during deposition. You can consider an interlayer such as chromium, and post-deposition annealing which can improve adhesion during e-beam evaporation.

Here are some references you may want to check:

10.1021/la063738o 10.1149/1.2108651 10.1039/c5ta07515g

10.1002/admi.202100068 10.3390/coatings8050186 10.3938/jkps.66.726