I am trying to simulate an ice adhesion test in LAMMPS using fix SMD. By assigning a pre-determined spring stiffness and control velocity, I am able to achieve delamination of the ice from the substrate surface.

However, I do not understand which computes can be utilized to assess the adhesion force required for this delamination?

Any insight into how fix SMD could be used with LAMMPS computes to obtain adhesion force is greatly appreciated.