I want to set-up an experimental facility to carry out Atmospheric Pressure Plasma Enhanced Chemical Vapor deposition (AP-PECVD) for deposition of SiOx coating. I have following questions

(1) Will droplet size variation in few micrometer affect the coating quality or we can procure a constant output atomiser.(0.35 micro meter)

(2) I need to put MFC after atomiser to control flow of precursor. The operating pressure would be 1 bar.

The air flow rate in atomiser is 3-3.5 L/Min at 2.5 Kg/cm2 and liquid flow rate is 20cm3/min.  The MFC should have how much differential pressure range to work efficiently.

Any good manuscripts on AP-PECVD with detailed description of experimental set-up would also be useful.