I am currently working on characterization of metal oxide contacts deposited on n-type Si substrate and plan to make it a MOSCAP for C-V measurements. After going through a few literature, I found people may use different areas and thicknesses while forming front metal gate although the back contacts are usually full-area contacts. I know it might depend on the dimension of the substrate. But I wanna know if there is a design rule for the front metal gate area and if there will be any issue if we make the front contact area too large?