I am fabricating a two terminal device (typical MIM`s). After having my organic material spin coated on the bottom electrode (ITO-PET) I wish to deposit gold as the top electrode through a shadow mask. Here, can I straight away deposit gold as a top electrode? or should I deposit a few nm of adhesion layer and deposit gold further. Will that change my Schottky barriers formed with the material. If I deposit gold as such, will the coating be stable enough for the measurements?
@Andrey,
Thank you very much. I didn`t phrase the question clearly. My bad...:). I have organic material spin coated on ITO and I wish to deposit gold on top of it through shadow mask. If I were to just evaporate/sputter gold on the top of spin coated organic material, will it have a good adhesion?
Warm regards,
Ram.
Dear Dr. Ram Kumar Balasubramanyam
Have anice time and good day
The adhesion force depends on the type of the organic material. So you must to try.
Thanks
Ram, I agree with Ahmed. Give it a try. You can often get meaningful capacitance and leakage even if the adhesion is not the best.
Any layer will affect your work function. Even putting your organic dielectric into the vacuum chamber and bombarding it with Au sputtering will affect your dielectric properties.
Hi Everyone,
I have tried the deposition and it seems, it is very much fine. The thickness is 150nm and it is very well stable to have a contact and measurement. Thanks for your insights..:)