For aerospace adhesive formulation, I would like to use dicyandiamide as hardener. But I couldn't dissolve the hardener particles in the epoxy. Please suggest the method to dissolve them. I used 100 :8, Epoxy to hardener weight ratio.
Thanks for the suggestion. The melting point of Dicy is around 205deg C and the curing temperature of epoxy system is around 110 deg C. it is accelerated urea curing. I never come across this idea of melting in any literature. Would like to know how adhesive technologists mix this hardener with epoxies.