I need a antenna with 2.4mm substrate thickness. Can we combine two same substrates with different thickness to get another thickness of substrate? (i.e) 1.6 mm combined with 0.8mm to get 2.4mm substrate ?
Dear Anad,
In agreement with Malcolm , you can join two plates by using an adhesive material like two components Uhu
or any adhesive. Then you press firmly against each other to avoid any air voids.
You can make an experiment and see how it is successful.
Best wishes
Yes, but make sure they are well bonded at the join, and all the metal is off at the join. You can get bonding film.
Dear Anad,
In agreement with Malcolm , you can join two plates by using an adhesive material like two components Uhu
or any adhesive. Then you press firmly against each other to avoid any air voids.
You can make an experiment and see how it is successful.
Best wishes
Yes you can bond two wafers back to back. This is well known since long time (since the early 1990's, as far as I remrmber). For instance, Refer to this article:
Back-to-back substrate wafer bonding: A new approach to the fabrication of double-side coated wafers, February 1997, Applied Physics A 64(2):211-212, DOI: 10.1007/s003390050467
Thank You Dr.(Prof).Malcolm White, Dr.(Prof).Abdelhalim Zekry, and Dr.(Prof).Muhammad Hamza El-Saba,
- Badges
- Science topic