I want to use organic binder instead of inorganic binder for metal powder compaction for comparative study between organic binder to other conventional inorganic binders.
The most widely used for advanced and electrotechnical ceramics are polyvinyl alcohol (water-soluble) or paraffine (distributed in CCl4), yet different options are possible. The amount of binder can be roughly estimated from particle size in the powder depending on the type of binder you use (thermoplast or reactoplast). I personally would suggest a non-water binders (paraffine or oleic acid mentioned above, latex dispersed in petrol and suchlike).
I do not know what would be technically beneficial for metallic powders, but PVA seems to work just fine.
I hope it helps.
Did you try CMC or Polyox. We are using it for tape casting of Ni-based green tapes.
For hardmetals (WC-Co etc), paraffin waxes are very common, with grades having melting points from around 50 to 70 Celcius. They contain normal paraffins and traces of iso paraffins, cyclo paraffins, alkyl benzines and oil
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