Hi,

I am using SU8-2035 to form microchannels of width 800 micron and 60 micron depth. I first used the following recipe based on the data sheet provided by the manufacturer and I had a severe delamination problem:

Dehydrate at 150C in oven for 30 min

coating on spin-coater

soft bake on hot plate: 65 C for 3 min followed by 95 C for 7 min

Note: the edge with thicker resist was still soft after the above bake time.

Exposure: 350 mj/cm2

Hard bake on hot plate: 65C for 3 min and 95C for 7 min

Develop for 7 min with agitation

result: complete delamination

For the second time, I changed the soft bake/PEB temperature and time to the following:

- Soft bake

67C for 10 min followed by 97C for 20 min

Slow cool down to 67C in 20 minutes

-Post exposure bake:

67C for 1 min followed by 97C for 7 min

developed after ~5 min

This time, the was no delamination but it can be seen that at the open areas the resist is swelled and about to detach from substrate.

Could anyone help me to resolve this issue?

Thank you

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