it depends where your plasma is? If your substrat is far away from the rf/DC sputter source, it will have a negligible impact on the plasma. The plasma are disturbeb by different surfaces mainly because different surface will emit a different amount of secondary electrons that feeds the plasma (especially at lower frequencies). But normally your samples are far away and do not interact with the sputter-plasma at the cathodes. (even if biased, the main plasma is at the cathodes).
Running PECVD, there it might be different since the sample is part of the plasma electrodes. So I would say go on with Alu foils.. usually the capton tape is used as long as the sample temperatures allows it.
( I hope we peak about the same substrate = sample, and not the cathode!!)
thanks for your answer, i can use capton tape but most of the four inch silicon wafer i have to cover. so that i am thinking about the Al foil.
You could possibly use PEEK material as a mask, depending on how hot your process is (melting point is somewhere around 340°C if I remember correctly), and it's compatible with ultrahigh vacuum processes as it doesn't outgas much.
Will there be any contamination due to Aluminium foil for the Deposition Chamber?
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