Dear all,
Any of you has experience in doing bonding PDMS channels to a microelectronic chip? Could you suggest some papers about that?
I am basically interested in knowing which are the differences in bonding PDMS to a microelectronic chip instead of PDMS-PDMS or PDMS-glass bonding.
Additionally, I would be happy to have information about the bonding strenth in a PDMS-electronic chip bonding.
Please, note also that the chip that I am going to use as a substrate is 3.5mm x 3.5mm in size and has a passivation layer of polyimide on the top. It was fabricated using 0.35um CMOS technology.
Any suggestion is welcome,
Thank you!
Hello Valerio,
Below are some resources you may find useful as a starting point.
Flexible packaging of solid-state integrated circuit chips with elastomeric microfluidics:
https://www.nature.com/articles/srep01098
A multi-scale PDMS fabrication strategy to bridge the size mismatch between integrated circuits and microfluidics:
Article A multi-scale PDMS fabrication strategy to bridge the size m...
Lab-on-a-chip devices: How to close and plug the lab?:
Article Lab-on-a-chip devices: How to close and plug the lab?
Kind regards,
Jules
Hi, usually PDMS can be bonded by oxygen plasma on Silicon based surfaces (Si02, SiNx, Glass) and most of the time the passivation layer of CMOS chips are made of Silicon nitride. The only thing that can be a problem is the flatness of the CMOS surface but the PDMS should maybe fit the surface.
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