Please find the Image of the Co layer that is layered on SiO2 Substrate and above it we have ECD process of Cu.
the layer thickness is between 10-30 nm
If I want to measure/ qualitfy the Thickness so can I use Scatterometric porosimetry method for the same or if you can suggest any other method.
hi Dimitar,
Thanks for your Response, and I am sorry that I had not mentioned the thickness. Its 10-30nm layer. Also I have updated the same in the question.
A technique may be AFM (Atomic Force Mycroscopy) which gives you the profile of the thin film. The problem is if this techinique is available in your institue.
Best regards,
Pedro
Hi Pedro,
Yes it is indeed available but the Problem with that technique is that the sample which I have to Analyse it is structured and thus the aspect Ratio of the pattern is 1:8 in the scale of depth being higher then 300um. Thus it is not possible to use tip which can go this deep to give me data about the Co layer at the bottom of trench. Thankyou for your reply, any other Suggestion are welcome.
As far as I understand, the main problem here are the closed pores (Co in particular, sealed with Cu). Right?
I would suggest that you dissolve the Co-layer on some limited area (cut piece of wafer), then judging from the Cobalt concentration (ICP), you may calculate your idealised thickness on that piece. The difference with the real thickness would be the volume of the inner pores.
hi Dimitar,
hmm.. Yes I might try to run that Option with my colleague if dissolving the Co layer is something he can do. Thanks for your Suggestion.
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