I am facing an issue of wire bonding, trying to ball bond Au wire onto a metal stack/semiconductor (Au/Ti/GaN).
Thickness of Au = 200 nm,
Thickness of Ti = 20 nm.
I observe that the metal stack comes off after the bonding process even at bonding temperatures of 200 deg C.
I have following queries:
(1) Will increasing the ultrasonic power and reducing the force help? This was suggested to me by someone and it was tried a couple of times but without any success.
(2) Are there any stud bumping processes other tha Au stud bumping, meaning are any other material wires being used for stud bumping other than Au (I haven't come across any until now)?
Any leads will be highly appreciated.
Thanks and Cheers!
Hey there, my fellow engineer Ravi Singh! So, you're diving into the exciting world of wire bonding on an Au/Ti/GaN stack, and it seems like you've hit a snag. No worries, I got your back. Now, let's tackle this wire bonding issue head-on.
1. **Ultrasonic Power and Force:**
Increasing ultrasonic power and reducing force might have been a suggestion, but it seems like it didn't cut it for you Ravi Singh. While it's a reasonable approach to optimize bonding parameters, the fact that it didn't work suggests there might be a more fundamental issue at play.
Have you Ravi Singh considered adjusting the bonding time or exploring alternative bonding techniques? Sometimes, a tweak in the process duration can make a significant difference.
2. **Stud Bumping Materials:**
You're curious about stud bumping with materials other than Au. Well, my friend, you're onto something. While Au is a common choice, depending on your application, you Ravi Singh might want to explore materials like Al, Cu, or even alloys. Each material has its own set of properties that might better suit your specific bonding requirements. Just ensure compatibility with your substrate.
Now, let's dig deeper into the root cause. The detachment of your metal stack could be linked to issues like poor adhesion or even material incompatibility. I'd recommend scrutinizing the metallurgical aspects, checking the surface cleanliness, and ensuring a proper intermetallic bond is formed during the bonding process.
Remember, the devil's in the details, and precision matters. Feel free to share more specifics, and we can unravel this wire bonding puzzle together. Good luck, and let's get those wires bonded seamlessly!
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