Dear Zhang Xinping,

You may want to look over the data below:

https://smif.pratt.duke.edu/sites/smif.pratt.duke.edu/files/operating/Fabrication%20of%20molds%20using%20SU-8%20Resist.pdf

Microsoft Word - Fabrication of molds using SU-8 Resist

SU-8. Silicon. 5. Post exposure bake on a first hotplate for 1 minute at 65C immediately followed by a second hotplate for 2 minutes at 95C. Allow to cool. 6. Develop a. 3 minutes 30 seconds in a beaker with SU-8 Developer at room temperature with slight agitation. b. Rinse with Isopropyl Alcohol (IPA) c. Dry with a nitrogen gun. Revision 1 M. Walters and J. Dalton 07/30/2013. Dow Corning Sylgard PDMS 184 Kit. Please see the website below for all of the pertinent information related to mixing ratios for the elastomer and curing agent contained in the Dow Corning Sylgard 184 PDMS Kit. http://ww...

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https://www.researchgate.net/post/What_is_the_right_procedure_for_Hard_Baking_SU-8

Best baking procedure for photoresists are using convectional oven. Specially in SU-8 the ramp up backing is required e.g. to reach the temp. 120C , set the initial temperature to 60C and than ramp up with step of 5C upto 120C. For hard bake at 250C , the same procedure can be followed. You can check the attached publication of my group. EMIT full. ... Just to add to the other good comments, MicroChem advise using a hard bake temperature 10 oC above the maximum expected operating temperature. The hard bake can also be useful for annealing any surface cracks that may have appeared. There is a specific document issued by MicroChem regarding the hard bake process, I have attached it in case it is of interest to anyone. Hardbake Infor. mation.pdf.

Dear Zhang Xinping,

Auxiliary information below may be of interest as well:

https://cecas.clemson.edu/~rodrigm/wp-content/uploads/2016/02/SU8-and-its-impact-on-microfluidics.pdf

SU-8 Photolithography and Its Impact on Microfluidics

Rodrigo Martinez-Duarte and Marc J. Madou

Best baking procedure for photoresists are using convectional oven. Specially in SU-8 the ramp up backing is required e.g. to reach the temp. 120C , set the initial temperature to 60C and than ramp up with step of 5C upto 120C. For hard bake at 250C , the same procedure can be followed. You can check the attached publication of my group. EMIT full. ... Just to add to the other good comments, MicroChem advise using a hard bake temperature 10 oC above the maximum expected operating temperature. The hard bake can also be useful for annealing any surface cracks that may have appeared. There is a specific document issued by MicroChem regarding the hard bake process, I have attached it in case it is of interest to anyone. Hardbake Infor. mation.pdf.