Kindly assist with my challenge. I used stress/atom commands in LAMMPS to calculate Von miss stress and hydrostatic stress of a silicon nanometric cutting. Unfortunately or fortunately I got hydrostatic stress of maximum -3GPa and 1GPa which is low compared to 11GPa - 14GPa for Si and diamond tool with 204241 atoms. Note, the hydrostatic stress is for tool atoms group. I attached the stress part of the script. If there is a need to attach the entire script, I will.