With a solid loading of 51%, the viscosity of my Si₃N₄ slurry is around 8000 to 12000 mPa.s. Removing pinholes at this high viscosity is proving to be quite challenging, and these pinholes are causing defects in the green sheet. Could anyone share insights or suggestions on how to address this issue and achieve a defect-free substrate?
The maximum acceptable viscosity for a non-aqueous slurry in tape casting is typically in the range of 1000 to 5000 mPa.s for achieving defect-free substrates, including Si₃N₄. The high viscosity of your slurry (8000 to 12000 mPa.s) may be contributing to the pinhole formation and defects in the green sheet.
To address this issue and achieve a defect-free substrate, here are some strategies to consider:
You may want to consider fine-tuning these factors and performing tests to determine the optimal conditions for your slurry to achieve a smoother, defect-free green sheet.
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