Crosslinking of thermosets is a diffusion-controlled process. If you perform crosslinking at room temperature the Tg (glass transition temperature) gradually increases and when it reaches room tmeperature the reaction slows down even if there are non-reacted groups. If you increase the temperature by a step the process goes further until the Tg reaches the elevated temperature. The same ossurs in postcuring. Additionally in post curing you go above the actual Tg value the chain mobility will increase, which may relax frozen-in stresses and may initiate agglomeratio of the particles, thus the observed electrical properties may change. If this not what ypu wanted to ask, please explain.

Crosslinking of thermosets is a diffusion-controlled process. If you perform crosslinking at room temperature the Tg (glass transition temperature) gradually increases and when it reaches room tmeperature the reaction slows down even if there are non-reacted groups. If you increase the temperature by a step the process goes further until the Tg reaches the elevated temperature. The same ossurs in postcuring. Additionally in post curing you go above the actual Tg value the chain mobility will increase, which may relax frozen-in stresses and may initiate agglomeratio of the particles, thus the observed electrical properties may change. If this not what ypu wanted to ask, please explain.

Gyorgy gave a very good explanation.

Usually post curing can raise the crosslink density, to give a close network for possible higher conductivity.

Gyorgy Banhegyi already explained well. With an increase in curing % ( during post curing) conductivity increases.

Is this a stand alone composite, or was it applied to a substrate? In general, epoxies tend to shrink when post-cured above the temperature of initial cure. I developed, manufactured, and used poly thick film materials (typically an epoxy thermoset resin or a polyester thermoplastic resin filled with conductive carbon, silver, or silica or other inert, non-conductive material to produce screen printable resistors, conductors, and dielectrics for electronics applications. Something that is often overlooked is the nature of the substrate on which the composite is deposited, especially the thermal expansion properties. You really need to do a complete temperature scan over a wide range and record the resistance at small temperature intervals and make a plot of temperature vs resistance. Be sure to include something like ceramic as a substrate in your tests. For example, when a thermosetting resistor formulation is deposited onto a substrate that has a large temperature coefficient of expansion and cured at a rather low temperature, then post cured at a much higher temperature, the resistor composition tends to shrink, but the substrate tends to expand. I think you can see that this can result in the resistor cracking during the post-cure, with a resultant loss of conductivity. However, when the sample is removed from the oven and cools to room temperature, an electrical check typically shows that the resistance is significantly lower than before the post-cure, as would be expected from the epoxy shrinking. When the resistor is connected to an ohmeter and placed into an oven that has the temperature increased in a slow ramp, the resistance is found to fall initially, as expected by the negative thermal coefficient of resistance of carbon, then begins to increase. If the glass transition temperature of the substrate is checked, it is usually found to be the same as the temperature at which the resistance increase starts. Hence, the resistor becomes a probe for Tg of the substrate. If the epoxy is a rather brittle one and the substrate has a large enough expansion as the temperature rises, an open circuit is obtained because the resistor cracks in multiple places that can be seen with the naked eye while still hot. Upon cooling, the substrate shrinks and pulls the cracked resistor back together so that a resistance reading is obtained. However, as might be guessed, the resistor shows significant variability under a voltage load.

Manindra , Here are few answers for you but my suggestion is to study first nano/micro order structure to decide its characteristics.

Often complete curing is not achieved when the composite is RT cured. For ensuring complete curing, post curing process at relatively higher temperature is generally carried.

If one did not know its fine structural finding then nothing can be estimated out of it , so for as the properties are concerned.