Take Ni as example, after annealed in vacuum at about 900C, grains with different orientation are formed, some are 111, some are 100, and some are 311, etc. So what play the role in determining the surface orientation? Temperature? Stress? Annealing time?
Is there a way control the orientation, lets say, all 111, or all 100?
Many thanks!
The main factors affecting crystallographic orientation changes occurring in a crystal during annealing are as follows:
1. Initial (pre-annealing) distribution of preferred orientations of the single crystals (grains) and residual stresses’ distribution.
2. Existence and character (type and direction) of initial (pre-annealing) dislocations and twins.
3. Initial (pre-annealing) distribution of grain sizes as well as the amount of low-angle grain boundaries and misorientation angles between sub-grains.
4. Dopants and alloying elements: amount, type (interstitial or substitutional) and displacement (bulk, grain boundaries, near dislocations cores, etc.).
In order to obtain more detailed answers on your question, a deep and comprehensive literature survey should be done. For example, please find the enclosed link of one of the possible sources which may be useful for you both “as-is” (which was made for electrodeposited Nickel) and “as an example” for a comprehensive study in this field: http://publications.lib.chalmers.se/records/fulltext/140580.pdf
To know how to control the orientation you can search on how to make single crystals?. Also some metal deposition techniques (if deposited on preferred orientation material or on single crystal ) can produce single crystals.
Concerning 100 texture, Ni is an excellent example of the material with high stacking fault energy, in which 100 texture can be achieved by cold rolling and subsequent recrystallization. This is widely used for producing the so called RABITS (Rolling Assisted BIaxially Textured Substrates) for coated conductors.
I attach an excellent review of this phenomenon.
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