We bought the E-beam evaporation system without a loading chamber.
until now, we have used this system about 20~30 times for the deposition of Al2O3, Ti, Au, and Al having thicknesses from 50~100 nm.
Initially, the high vacuum was easily reached, but suddenly it took more than twice as long. When I first used it, I reached a high vacuum very quickly, but suddenly it took me more than twice as long to reach a high vacuum. The company explains that it is an outgas phenomenon, but I wonder if it can take a long time to reach a high vacuum so quickly.