I have used 2 time sputtering system in my lab for the deposition of CoFeB, after which I am not able to deposit any other material in the same system (MoO3, ZnO), also I am not able to tune the RF power with the matching network.
The deposition of a magnetic material onto the inner walls of your deposition chamber (and perhaps onto other components that yoy may have inside, for instance a collimator chimney on top of the target, etc) may alter slightly the magnetron effect in your sputtering source. FeCoB takes many magnetic field lines and as a result the magnetron effect decreases. You can try to change the configuration and/or strenght of your magnets below the other targets (MoO3, ZnO) and also increase the gas Pressure.