We prepared TEM sample (Si or Glass substrate) by FIB then loaded it to TEM Cu-grid. Unfortunately, the glass substrate sample seems doesn't well attached to the grid, and may flew away/dropped during loading it to the holder or TEM. This problem never happen for Si substrate sample. Is there anyway to enhance the attachment between the sample and the grid? Thank you.
Try three small dabs of colloidal silver paste (available through the TEM supply houses), Allow to dry - the solvent evaporates quickly for small dabs.
I've used this frequently with TEM grids in ultrahigh vacuum chambers, and it works well.
@L. Gence
the average thickness is about 100 um.
@Volker Klemm
Thank you for the suggestion. We found that reducing the glass volume still doesnt fix our issue.
However, when we put the sample on thicker grid it attached well.
But still don't know why.
@Peter Edward Diehr and L.Gence
Thank you for the suggestion Sir.
Would you give some more information regarding this coloidal silver please Sir?
any specific product type/brand that is commercially avaliable?
PELCO colloidal silver paste; the supply houses who sell TEM grids usually carry a similar product.
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