I am working in the development of microporous electrode using copper wire. The SiO2 beads templates used here on Cu and then Ni electrodeposited. Here I am interested to know how much surface area increased after the formation of micropores in comparison with bare copper wire.
I think it's difficult task, because using cyclic volyammetry both metalls both are solved and form phase films of oxides and salts on their surfaces- unlike Pt which forms strictly хемisorbed layers of hydride or охide. It is possible to estimate only, in how many times the surface of porous metal is more than surface of smooth metal. To solve your task it is necessary to use also coulometry or elipsometry.
Yours Владимир Shepelin
you can use double layer capacitance values by doing cylic voltammettry and compare it to the mirror polished Nickel surface. People usually use perchloric acid ( 0.5M) or sulfiric acid. Perchloric should be a better choice I guess due to weak adsorption. What you do is to scan the potential in non-faradaic region ( this you have to find by scanning around-0.2V vs RHE to 0.2 V vs RHE). IF you need more info pls let me knowI can send you some articles.
Thanks, Kas,
I will try this. Please send me some paper on this it will be more helpful for me.
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