One option is that you can coat the Cu/hBN by PMMA, and then etch the Cu out.
hBN surface you may o2-plasma treat to increase the binding ability.
Alternatively, you also can etch the Cu without PMMA coating, but this approach requires extremely delicate handling (presumably hBN is a few layer thick), here the film will stay on the surface of the water (Cu-salt solution in water).
One option is that you can coat the Cu/hBN by PMMA, and then etch the Cu out.
hBN surface you may o2-plasma treat to increase the binding ability.
Alternatively, you also can etch the Cu without PMMA coating, but this approach requires extremely delicate handling (presumably hBN is a few layer thick), here the film will stay on the surface of the water (Cu-salt solution in water).
What about a thermal release tape (TRT) provided by (Sunup High Tech Co). I used it to transfer CVD grown monolayer graphene directly to SiO2/Si substrate.