I have a a question regarding surface modification of SiO2 chip. The presumption is that vapors of trimethylsilanol (CH3)3SiOH bond with the original hydroxyl terminated surface of the chip and cause wettability issues, not unlike the manufacturing process of hydrophobic sand (Magic Sand). Could someone please advise how would we go about removing these methyl terminating groups from surface and restore the original hydrophilic hydroxyl group termination?Oxygen plasma did not seem to have an effect on improved wettability. Surface is Si₃N₄, SiO₂, aluminium pads.
Thank you for ideas.
Piranha, which is a hazardous mixture of sulfuric acid and hydrogen peroxide
Dear all, hydrolysis with H exchage in water with some chemicals. See attached files. My Regards
Dustin W. Janes thank you though wouldn't that have a violent reaction with the aluminium bondpads?
Abdelkader BOUAZIZ i may have misunderstood these but it seems to show the opposite of what is wanted. If it is feasible, we want to remove the TMS endcapping and restore the original hydroxyl endcapping.
Dear Jan Matyas, yes I understand, just focus on the reversibility of the reactions whether base catalyzed or not. I have other paper I will check and send them if they are more direct. My Regards
Dear all, the attached files summerizes protection-deprotection of chemical groups including the case of trimethylsillyl with the corresponding references. My Regards
Dear all, the attached file is the one I was looking for. My Regards
Dear all, this link is very interesting. My Regards
https://www.masterorganicchemistry.com/2015/06/17/protecting-groups-for-alcohols/
Abdelkader BOUAZIZ Upon first look the last link looks very promising! Thank you for the recommendation!
Dear Jan Matyas, yes fluorine ion is the most efficient way to regain back OH group. Good Luck
Hi;
Sulphochromic acid or sulfuric acid/H2O2 mixture
With my best regards
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