Dear all,
I need to prepare electrical contacts in order to connect a gold pad with a semiconductor (few microm size) . i cannot perform lithographic process. Hence, how can I obtain good conductive connections? I'm trying with electron beam induced deposion (EBID) of Pt, but the C contamination make it highly resistive.
any suggestions?
What is the distance between the sample and the pad? Is it feasible to use a microdroplet of conductive epoxy or silver paint to connect the two?
This is gonna be difficult without any access to lithography or shadow masking of some sort...
The platinum EBID tracks should be conductive enough, I think, if done properly. You can try to reduce the amount of adventitious carbon deposition by cleaning the sample thoroughly with solvents prior to EBID, and by keeping the electron beam dose low – I believe doses below 1e18/cm^2 will polymerize hydrocarbons to more sp2 rather than sp3–type carbon, which should have a much lower resistivity.
Also, I'm not sure how you're doing the EBID, but if you can do directional EBID, you can definitely also expose resists in this way to do lithography (even if not terribly accurate). For example, if you are just doing this by imaging with the broad SEM raster, rather than patterning precisely, could you not just image the resist until it's exposed?
Other than that, you could maybe try transferring CVD graphene films between the two targets to act as an interconnect, if you have tools available to do this...
The best way is to use a wire bonder for micro size conducting pads. You should be able to find such bonding machine in any semiconductor related research groups or centres.
thank you for your replies. Unfortunately I cannot spin any resist on the substrate. Wire bonder already tryied...not enough spatial resolution. I'll try with Ion-induced deposition (IBID) of Pt...maybe Ga+ ions can help
my wire bonder enables to prepare connections only above 15microm large....so it's not ok for my sample
you can make use from this book
Electrical Conductive Adhesives with Nanotechnologies by C.P. Wong et al.
and this attached paper
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