I would expect that Ellipsometry will be your method of choice.

https://en.wikipedia.org/wiki/Ellipsometry

https://books.google.de/books?hl=de&lr=&id=tTMn0NKcpjsC&oi=fnd&pg=PR7&dq=Ellipsometry&ots=NqSWvoQSrO&sig=VFe_K1o-ObRavaXXXTYXil64TAQ#v=onepage&q=Ellipsometry&f=false

https://books.google.de/books?hl=de&lr=&id=6PQf1fSzHHEC&oi=fnd&pg=PP1&dq=Ellipsometry&ots=_AOjlpfjr_&sig=xYm6a0UMv6EsaIDhiMv_7qAvWr4#v=onepage&q=Ellipsometry&f=false

https://books.google.de/books?hl=de&lr=&id=SA0KU2JEtwsC&oi=fnd&pg=PP1&dq=Ellipsometry&ots=KPUCHO9-Dl&sig=-3dGF1WokIeadTkMAvVt45VNlnI#v=onepage&q=Ellipsometry&f=false

You may also try to use XPS with variable angle of incidence.

Dear Dr. Thomas Simons

Is it possible to measure thicknesses up to 1 micron?

Have you any documentation about this method?

regards

Dear mohammad

you can use SEM  analysis for it.

Hello Mohammad,

unfortunately I am not an expert for this method. The details like limits of the measurement will depend from the equipment and your sample. But in general thickness up to 1µm should be possible.

For documentation: see the links posted above. 

How precise should be the measurement?

But Ellipsometry would be also my first choise.

Dear Sabrina Reuter

Thanks for your reply. untreated titanium contain oxide layer with minimum thickness of about 8 nm.

What about GDEOS?

Ellipsometry is method of choice. You can also go for quartz crystal mmicrobalance (QCM) analysis as it is frequently utilized for studying layer by layer system. 

Ellipsometry measures the phase change of light in reflection: if this should work you need reliable dielectric functions (real and imaginary part)  for substrate (Ti) and titania (TiO2); for the latter you would need to know whether there are differences for the three phases (anatase, rutile, brookite) that can exist. This is not trivial.

AFM and SEM will only show you the surface; this will only be useful if the titania forms nanoparticles below which the substrate is still visible.

You can use a focused ion beam (FIB) in an SEM to make a trench cut and examine the sides which show the film on top of the substrate. If the thickness is between 10nm and several microns, you can measure it direct (taking the tilt angle into account).

If  the thickness is

you can use

• SEM  and AFM analysis for it
•  weight difference method t=dalta W/s.density of material
• optics method , interferometer Michelson (Film thickness measured after deposition by optical method using He-Ne laser (0.632 μm) The film thickness (t) is calculated using the formula t=daltax/x.lamda/2; where is the thickness of sample,  is fringe width and is the distance between two fringes and  is the wave)

 Hi,

In addition to clarifying the above researchers, It is important to use the D-500 Stylus  measure a wide range of applications in 2D, from nanometer to millimeter steps, high resolution roughness, soft materials, and thin film stress. As it also, use the EIS measurements.

Regards,