Our evaporated gates (in vacuum chamber @ 1E-6 mbar) consist of two different materials with different thermal expansion coefficients. After cooling down the sample to 0.3K, they act like a bi-metall, which produces stress to our substrate. In order to evaluate that stress, I do COMSOL simulations. The strength of the stress is dependent to the ratio of the thermal expansion coefficients and to the difference between the temperature of deposition and the temperature to which the sample will be cooled down in order to measure it.
The challenge now is to estimate the temperature of deposition, which is the one for zero thermal expansion. For sure there is a big difference in taking the temperature of the cooled substrate during evaporation and in taking the ones of the melting points of the materials.
Any ideas? Are there any publications about the build-up temperatures of metal crystals while vacuum evaporation/deposition processes?