The simplest qualitative way is to measure the contact angle of water on the surface. You can also measure the change in water surface tension using a Quartz crystal microbalance and a piece of platinum or a Wilhelmy plate.
Hello,
I don’t understand your question. There are 2 possibilities:
1) If you want to measure the non-wetting of SAC305 solder on a copper sheet, you test a copper sheet (100% chemical Cu, just depolluated and desoxidated with solvents and acids) in a wetting balance (also named meniscograph). You will obtain a negative wetting force. No positive solder meniscus will be created because no flux was used on copper sheet. For me, there is a low interest to study this phenomenon.
2) If you want to measure the positive wetting of SAC305 solder on a copper sheet, you must flux the sheet. Then you test a copper sheet (100% chemical Cu, just depolluated and desoxidated with solvents and acids) in a wetting balance. You will obtain a positive wetting force.
But the results will depend to 3 elements simultaneously: the flux, the SAC305 and the temperature of molten solder bath. So actually you measure the surface tension of the flux in SAC305 solder for a given temperature. If you change one of these elements, the results will change.
The calculation of wetting force will be given by the attached formula.
Best regards,
Denis
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