I have a flat surface with microstructures on top of it. The structures have the size (height, width, length) of about 1 micron. I want to get a flat surface again, by putting material on top of the structures. How much material I have to evaporate/spin coat on top of the structures in order to get a flat surface again?
It depends on the deposition method you want to use. Sputtering is not uniform coating method, its step coverage is not good. PECVD will be a good choice. It is hard to tell how much material do you need, I don't know any formula. I think you need to find it by experiments. I suppose it should be between 2.5 to 3 micron. Let me know what you find out. Thanks
Depending on the roughness you are focusing, you can try by coating with 1, 2 or 3 µm thickness and comparing the surface topography obtained.
Hi Mr. Anton,
As mentioned above, it depends on the method and the existing depth profile that you currently have now. Assuming, your structures as some morphologically hierarchial fabricated structures. If you want to coat something onto it, you have to do it stepwise, such that, you can study the fabricated substrate based on varying thickness profile. That will also give you a fool proof experiment to get a better conclusion. Most of the coating techniques, when performed may show uniform depth profile however, after sintering, calcining, or merely heating, the grain boundaries, particle size, coating thickness will always be varying, hence, your substrate parameters cannot be unifrom before and after reaction.
All the best
Krishna
Hi,
I was hoping there would be some kind of thumbrule, but it seems that there are some question which can only be solved expirementally. Thank you for the answers.
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