I read some of research, which mentioned that they used FEGSEM and SEM to measure the thickness of CE in DSSC. But could I measure it without make a cross section?? and why?
is it a metal? how do you deposit the metal? One way is to create a "step" in the material, meaning a region with no material deposited, and then measuring the step height with AFM or profilometry. The step can be done by scratching the film or using lift-off (sometimes a piece of tape does the work). If it is a well known standard material, you can use sheet resistivity measurements. If it is a transparent material you can use ellipsometry and if absorption coefficient is known you can use transmission measurements.
Layla Haythoor Kharboot I would try (1) scratching the film after deposition, or (2) lift-off using a piece of tape, here is how to do each:
The idea of this technique is to remove the material of interest while preserving the materials underneath, then use AFM or profilometry to measure the valley depth. If you have a multilayer, say glass, film A and then film B, you can fabricate a sample with just film A and then a sample with both A and B (A deposited at same conditions), then due to the scratch on both to get the thickness of A and A+B. The disadvantage of this method is that it will work depending on the adhesion of the film to the substrate and the softness of the substrate, since you need to scratch the films without damaging the substrate, so try with different objects, I have used knives, pipette tips, etc. Do this right after deposition while the film is still soft.
Here you use a piece of tape to cover a substrate region, then deposit the film, remove the tape and measure the step size. If the films underneath are damaged by the tape you can follow a similar approach as in the multilayer technique above. The disadvantage of this is that the tape can leave adhesive on the substrate creating a rough surface that may complicate the step measurement.
I have attached pictures of profilometry measurements of the scratch technique using a pipette tip to remove a polymer from a glass slide, and the tape method using kapton tape to lift-off a "cross" pattern of Aluminum on Silicon. You can also use AFM.