Nickel is electroplated onto a metallic component. The component has to perform in hot region. What can be done to minimise base metal diffusion under thermal gradient into the nickel coating?
Please describe your problem in more detail.
The fact is that interdiffusion in the iron-nickel system proceeds at temperatures above 700°C. At such high temperatures, electroplated nickel coatings are not used, so this is usually not a problem.
Or do you mean copper based base material? In this case, the diffusion temperatures are lower, but details are needed to solve the problem.
Using larger grain sized materials can be tried as a solution. Grain size is highly controllable with electrodeposition parameters. Using DC instead of pulse current, or application of smaller cathodic current density may increase the grain size. The grain size of the substrate may be increased by heat treatment or substrate material can be chosen accordingly basen on this idea. By this method, you can eliminate easy path diffusion through grain boundaries.
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