Hello everyone,
I am depositing 100 nm Ti on porous thin films (200 nm thickness, pore size 3-30 nm) using E beam physical vapor deposition. The coating looks good but I am not sure if Ti vapor will leak into my porous film as well before it fully condenses. I know that the substrate temperature during PVD won't be too high and vaporized metal atoms may not have much kinetic energy. However, i am still a little concerned that there still might be chances for atoms to diffuse into nanopores. I might be overthinking and i would really appreciate it if anyone can provide insights into this. Thanks!
Hi Yiwei Qiang ,
In Physical vapor deposition, any surface that is exposed gets metal evaporated onto it. If the Pore size is too small, it may be just blocked by the metal evaporation. 200nm film thickness will definitely get some of the 100nm of Ti inside the pore if not all. I think your concern is valid. If I were you, I would try to cover the holes with the lift-off resist and then evaporate the metal everywhere.
Regards,
Raja
How are you going to cover the pore? is there any pattern of pores? I don't think so. Do you want pore in the film? As suggested, some of the pore will be blocked,. Ti will also diffuse if the substrate is metallic. concentration of Ti then determined by solubility of Ti in substrate. If substrate is not metallic, then check out phase diagram of Ti and your substrate material to know more about the Ti diffusion.
- Badges
- Science topic
- Similar topics
- Chemistry
- Nanotechnology
- Nanostructures
- Thin Films