Hello everyone,
I am depositing 100 nm Ti on porous thin films (200 nm thickness, pore size 3-30 nm) using E beam physical vapor deposition. The coating looks good but I am not sure if Ti vapor will leak into my porous film as well before it fully condenses. I know that the substrate temperature during PVD won't be too high and vaporized metal atoms may not have much kinetic energy. However, i am still a little concerned that there still might be chances for atoms to diffuse into nanopores. I might be overthinking and i would really appreciate it if anyone can provide insights into this. Thanks!