When it comes to packaging and setup for surface mount battery/supercapacitor setups, there are a few key factors to consider. Firstly, you need to ensure that the package is compatible with the surface mount technology (SMT) process. This typically involves using a standard surface mount package, such as a quad flat no-lead (QFN) package. Additionally, you need to consider the thermal management requirements for the device, as supercapacitors and batteries can generate heat during operation. It may be necessary to incorporate thermal vias or heatsinks into the package design to dissipate heat effectively. Finally, you need to ensure that the package design provides adequate protection for the device during shipping, handling, and use.