2024 4th International Conference on Electronic Materials and Information Engineering (EMIE 2024) will be held in Guangzhou, China from May 24 to 26, 2024.
EMIE 2024 is a leading conference for all researchers from different countries and territories to present their research results about Electron Device and Mechanical Engineering.
---Call For Papers---
The topics of interest for submission include, but are not limited to:
(a) Electronic Materials
- Physical Chemistry
- Semiconductor Material
- Conductive Metals and their alloys
- Electromagnetic Shielding Material
- Dielectric Material
- Piezoelectric and Ferroelectric Materials
- Magnetic Material
- Optoelectronic Material
- Integrated Circuit
- Electronic Information Computer Materials
(b) Information Engineering
- Electronic Science and Technology
- Information and Communication Engineering
- Optoelectronic Information Science and Technology
- Engineering Optics
- Information Optics
- Electronic Technology
- Photoelectric Technology
- Communication Technology
- Measurement and Control Technology
- Computer Application Technology
All accepted full papers will be published on Conference Proceedings and submitted to EI Compendex and Scopus for indexing.
Important Dates:
Full Paper Submission Date: March 12, 2024
Registration Deadline: May 22, 2024
Final Paper Submission Date: April 23, 2024
Conference Dates: May 24-26, 2024
For More Details please visit:
https://ais.cn/u/eMVNvq
Invitation code: AISCONF
*Using the invitation code on submission system/registration can get priority review and feedback