2024 4th International Conference on Electronic Materials and Information Engineering (EMIE 2024) will be held in Guangzhou, China from May 24 to 26, 2024.

EMIE 2024 is a leading conference for all researchers from different countries and territories to present their research results about Electron Device and Mechanical Engineering.

---Call For Papers---

The topics of interest for submission include, but are not limited to:

(a) Electronic Materials

- Physical Chemistry

- Semiconductor Material

- Conductive Metals and their alloys

- Electromagnetic Shielding Material

- Dielectric Material

- Piezoelectric and Ferroelectric Materials

- Magnetic Material

- Optoelectronic Material

- Integrated Circuit

- Electronic Information Computer Materials

(b) Information Engineering

- Electronic Science and Technology

- Information and Communication Engineering

- Optoelectronic Information Science and Technology

- Engineering Optics

- Information Optics

- Electronic Technology

- Photoelectric Technology

- Communication Technology

- Measurement and Control Technology

- Computer Application Technology

All accepted full papers will be published on Conference Proceedings and submitted to EI Compendex and Scopus for indexing.

Important Dates:

Full Paper Submission Date: March 12, 2024

Registration Deadline: May 22, 2024

Final Paper Submission Date: April 23, 2024

Conference Dates: May 24-26, 2024

For More Details please visit:

https://ais.cn/u/eMVNvq

Invitation code: AISCONF

*Using the invitation code on submission system/registration can get priority review and feedback

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