Teju Tunde Olawumi

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Questions related from Teju Tunde Olawumi

Which is the best way to get rid of copper residue on the back side of wafers following plating even after bevel edge clean and backside clean?

Following electroplating of Cu, residues of Cu are seen on the backside of the wafer. Bevel edge clean and backside clean seem to make it worse. Probably increases the roughness of the backside...

21 February 2015 8,874 3 View

What could be responsible for arcing during via etch in a vacuum chamber?

During BEoL via patterning, arcing is observed sometimes to the point of wafer breakage(seal band arcing). Failure analyses show craters at the point of the arcing. These craters appear at other...

12 February 2015 3,291 12 View