Presently I am fabricating Back gate FET , for back gate I have decided to use Au. Can anyone suggest what should I use as adhesion layer and why ?

For back gate I have decided to deposit Au over Si wafer. I have studied in papers, people generally use Cr, Ni, Ti as adhesion layer between wafer and metal. But no one mention reason for...

20 October 2016 4,722 2 View