I am trying to do wiring on contacts (250um) of Cr/Au made on patterned nanostructures of width around 100 nm. I have tried Ball wire-bonding and finding that nanostructures are breaking while bonding.
Please do suggest possible ways of wiring and how this breaking of nanostructures can be avoided while wiring?
Thank you.
Hello Neeti Keswani ,
What equipment are you using and what material are you using for the bonding? Do you have a schematic for the layout? How close are the nanostructures to the contact pads?
For instance, I was using a Kulicke & Soffa 4526 bonding with a 25 µm diameter Au wire, contacting Cr-Au landing pads. The landing pads were a few hundred micron away from my nanostructures.
Enrico Macrelli provided a very comprehensive answer to my own question regarding wire bonding, providing several useful resources:
https://www.researchgate.net/post/Can_anyone_help_optimise_parameters_for_gold_to_gold_wire-bonding
Attached is a Springer chapter on copper wire bonding, maybe this is also of use. Also see the following:
https://electroiq.com/2006/07/wire-bonding-considerations/
Hello Jules Llyod
Thank you for your reply.
I am using Tpt hb 10 system and using 25um gold wire.
The nanostructures are ~ 750 um far from contact pads. The bonding comes out fine but nanostructures are getting destroyed.
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