It was seen from experiments that surface roughness values start slight reduction with increase in pulse on time values above 200 µs. While for pulse on time values below 200 µs, it is continuously increasing. What is the reason behind this behaviour?
Workpiece: Ti6Al4V
Tool: Copper
Dielectric: paraffin oil
The increase in pulse on time means applying the same heating flux for a longer time. This will cause an increase of heat that is conducted into the workpiece as the plasma channel expands which will result in an increase in the MRR. As the discharge duration increases, the pressure inside the plasma channel will be lower. So, no more increase in MRR since the molten metal volume does not change and further increase may be a cause to decrease MRR slightly.
Mohamed,
You have explained the effect of increasing pulse on time on MRR beautifully. Thank you for that. But I'm concerned with the effect of pulse on time on surface roughness. Does the effect is similar as in the case of MRR? Or is there some other reason?
So asked one can just as superficial answer. My first question would be, they have even looked at their current and voltage waveforms for the various pulse durations? The next question would be, if they increase their pulse duration, the changing patterns crater depth and crater diameter. In the roughness is essentially only the crater depth. The next question is to what extent, a process optimization for the respective processing parameters carried out (process stability)?
And so the step by step further.
- Badges
- Science topic
- Similar topics
- Engineering
- Mechanical Engineering