Is it possible to dissolve the glass bond of aluminum oxide grinding wheel so that only the aluminum oxide grains can analysed?
HF will dissolve alumina. I advise you to steer clear of HF. It's a highly dangerous chemical.
You may want to check the following paper: http://onlinelibrary.wiley.com/doi/10.1111/j.1151-2916.1999.tb02279.x/abstract
Whenever cutting hard materials by contact methods the cutting force varies. On the similar lines, does the laser power varies during metal cutting by laser?
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For a ground steel bore of 55 mm internal diameter.
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Anyone can recommend any books on such topics? Thanks in advance.
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Favourable conditions of base pressure, rate of deposition. Also, by which characterisation technique to be used to verify the thickness of the deposited film.
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