The problem I have suffered is that when I coat the slurry on the cupper by an applicator with 50μm, there were particles observed. I think it might be caused by agglomerated particles whose sizes of primary particles range from 500nm to 1μm.
This is the process of coating slurry on cupper. First of all, Li4Ti5O12 (LTO, active material) and carbon black(C.B, conductor) are mixed by mortar and pestle for 10 minutes, then, N-Methyl-pyrrolidone(NMP, solvent of slurry) with 6%wt of a Polyvinylidene fluoride (PVDF, binder) in it and additional NMP are added to make a slurry that has honey like viscosity. Next, a slurry is coated on the cupper. Here, when it is coated on cupper, there were many particles observed.
How can I avoid particles from agglomerated?
Thank you.
Dear Hyunsu,
For electrode preparation, LTO and CB should be homogeneously dispersed in binder solution by stirring for several hours using a mixer or a magnetic stirrer. Ten minutes is very short time for hand-making slurry by pestle and mortar. Viscosity of your slurry must not be high. Also you should degrease the Cu-foil with acetone.
Good luck.
I do not think they are agglomerations. LTO dispersion in NMP is usually not very good. Its just the material is different.
Try to re-clean very well the substrate's surface, just before the process of coating.
Dear Hyunsu,
For electrode preparation, LTO and CB should be homogeneously dispersed in binder solution by stirring for several hours using a mixer or a magnetic stirrer. Ten minutes is very short time for hand-making slurry by pestle and mortar. Viscosity of your slurry must not be high. Also you should degrease the Cu-foil with acetone.
Good luck.
I guess the particles observed when coating the slurry on copper came from the Li4Ti5O12 synthesized. The grinding process deserves more time and patience.
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