For polishing of Silicon wafer, we cannot produce a mirror-like finish using CIP, abrasives and oils. Thus the necessity of using the chemicals arises, which can soften the wafer surface and the abrasives can produce such finish.

So, what chemicals can assist in achieving the same? How much percentage do we need to mix it in the MR fluid? What are the chemical reactions occurring (which are helpful for the application) and does not affect the surface?

Also which abrasive is useful for polishing of Si-wafer? Is it SiC, Al2O3 or CeO2? or any other? please suggest.

More Mayank Srivastava's questions See All
Similar questions and discussions