As described in topic, I am looking for some related industry applications for my research, which is about semiconductor micro-machining. Unfortunately, my understanding of the semiconductor industry only comes from books and I am not familiar what it looks like in real CPU or MEMS factory. I want to find some typical semi device with precise corresponding micro-structure on top and back surface, which means the position of these structures are corresponding one by one, as shown in figure.
Many thanks for your kind suggestion and help.
Perhaps you can look at some of Silicon Drift detectors (e.g. manufactured by Ketek Gmbh). They may and use such technology.
Dear Hao,
For the alignment of the top surface pattern and back surface pattern i thing it is good possible by making alignment vias. The vias are holes penetrating the whole thickness of the wafer. Etching holes in the wafers are feasible and it is now a common process in the semicondcutor industry.
Best wishes
There are maskless aligners out there that use backside alignment (Heidelberg), which enables what you are asking about. There are also aligners that use IR optics to see through Si and other materials to align with the opposite side.
- Badges
- Science topic