How to differentiate between a stacking fault & grain boundaries in a TEM image?
By common definition stacking faults and grain boundaries are planar features having the same crystal structure on both side. A grain boundary implies a different orientation of the two parts, whereas a stacking fault has both crystals in the same orientation on both sides of the boundary. Typically the boundary is caused by translational misfit, i.e. the translation lattice of both crystals are shifted with respect to each other by a non-translation vector. In this sense a antiphase boundary is a special type of stacking fault.
It can be distinguished very clearly by using TEM analysis. Even I worked with SS 304 steel by laser shock peening process...https://doi.org/10.1016/j.mtcomm.2022.104200. you can refer it in TEM section. Hope this may help you.
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