I've already deposited Cr layer on glass substrate and then formed a TiO2 structure on it and sputtered gold on TiO2 and Cr layer. Now i face the problem for lifting off that TiO2 layer. I've also tested sonication in water and acetone. Also sulphuric acid was tested but my gold layer was damaged. If you have any idea please let me know.
TiO2 thickness: 300 nm
Au layer thickness: 50 nm
Many thanks~
If the glass has a smooth surface you might use AC electric fields to separate the conductors from the insulator. Something like this happened to my equipment when it was not helpful to the work. Also a ground strap on the metal might help if the metal layers act as one plate of a capacitor.
Also DC charge of extra electrons on the metal might make the separation. If not then you might try opposite polarity and deficiency of electrons.
Care is needed to avoid excessive fields that might tend to separate the metal layers from each other.
Thanks Mr. Decker but i have the problem about making contact with TiO2 layer due to its nanostructure, actually it can't be wire bonded and the TiO2 layer is buried under the gold layer.
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